BGA stands for "Ball Grid Array" in BGA assembly. It is a type of surface-mount packaging used for integrated circuits (ICs) where the connections between the IC and the printed circuit board (PCB) are made through an array of small solder balls. These solder balls are arranged in a grid on the underside of the package, allowing for a high density of connections in a relatively small space. The use of a grid of solder balls provides better electrical performance and thermal characteristics compared to some other packaging methods. BGA assembly is commonly used in a variety of electronic devices, especially those requiring compact and efficient designs.