HDI PCB technology refers to the advanced manufacturing techniques used to create High Density Interconnect PCBs. These techniques allow for the creation of circuit boards with higher component density, smaller vias, and more complex interconnections. Here are some key aspects of HDI PCB technology:

1. Microvias: Microvias are small holes drilled into the PCB layers to establish connections between different layers. These vias are much smaller in diameter compared to traditional vias, allowing for higher density and more intricate routing.

2. Blind Vias: Blind vias are drilled from the outer layer of the PCB to one or more inner layers, allowing for connections to specific layers without passing through the entire board. This enables more efficient use of space and better signal integrity.

3. Buried Vias: Buried vias are drilled between inner layers of the PCB, connecting specific layers without extending to the outer layers. This further increases the routing density and allows for more complex interconnections.

4. Sequential Build-Up: HDI PCBs are often manufactured using a sequential build-up process. This involves creating multiple layers of the PCB individually and then laminating them together. Each layer can have its own microvias, blind vias, and buried vias, enabling more intricate and compact designs.

5. Laser Drilling: Laser drilling is commonly used in HDI PCB manufacturing to create small-diameter vias with high precision. Laser drilling allows for smaller vias and finer trace widths, enabling higher component density and better signal integrity.

Overall, HDI PCB technology combines various advanced manufacturing techniques to achieve higher component density, smaller form factors, and improved performance in electronic devices. It enables the creation of smaller, more powerful, and more reliable products across a wide range of industries.

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