HDI stands for High-Density Interconnect, and it refers to a type of printed circuit board (PCB) manufacturing technology that is designed to increase the density of interconnections between components on the board.

HDI technology utilizes smaller and more densely packed vias, pads, and traces on the PCB, which allows for more components to be placed on a smaller board size. It also uses microvias, which are tiny holes that connect layers of the PCB, providing more routing options and enabling higher-density designs.

The use of HDI technology in PCB manufacturing allows for the creation of smaller and more compact boards, making it an ideal choice for applications where space is limited, such as in smartphones, tablets, and other portable electronic devices. HDI technology also provides better electrical performance, reliability, and signal quality due to reduced parasitic capacitance and inductance.

Overall, HDI technology enables the design and manufacture of complex, high-performance PCBs with improved functionality and reduced size.

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