The process of HDI PCB manufacturing in China generally involves the following steps:

1.Design: The design process begins with the customer providing the HDI PCB manufacturer with the design files, including the schematic, layout, and other specifications.

2.Material procurement: Once the design is finalized, the manufacturer procures the required materials, including the PCB substrate, copper foil, and other components.

3.Drilling: Next, the manufacturer drills small, precise holes in the PCB substrate, using laser drilling or mechanical drilling equipment.

4.Copper plating: The drilled holes are then copper plated, using a process called electroplating. This adds a layer of conductive material to the inner walls of the holes.

5.Lamination: The PCB substrate is then layered with additional copper and substrate material, creating a multilayer structure.

6.Imaging: A photosensitive layer is applied to the top of the PCB substrate, and the design is imaged onto it using ultraviolet light.

7.Etching: The unexposed areas of the photosensitive layer are then etched away, leaving behind the desired copper traces and pads.

8.Solder mask and silk screen printing: The PCB is then coated with a solder mask layer, which protects the copper traces and pads from oxidation and other forms of damage. Silk screen printing is also used to add labels and other markings to the PCB.

9.Surface finishing: Finally, the PCB is finished with a surface coating, such as gold, silver, or tin, to improve its durability and electrical properties.

Throughout the process of the HDI PCB manufacturer in China will use quality control measures to ensure that each step is performed correctly and that the final product meets the customer's specifications and quality standards.

Get more knowledge about  the process of the HDI PCB manufacturer in China please refer to Rigao PCB：https://www.rigaopcb.com