HDI PCB is a type of advanced PCB technology that is used to create high density and complex circuits within a smaller surface area. HDI PCBs use microvias, which are small holes drilled into the PCB, to create more interconnections between the layers of the board. This allows for the creation of more layers within a smaller surface area, resulting in a higher density of interconnects and more complex circuits.

HDI PCBs typically have more than 4 layers, and some designs can have up to 16 or more layers. The use of microvias in HDI PCBs allows for smaller trace widths and spacing, which makes more efficient use of board space. This is particularly important for applications where size and weight are critical factors, such as mobile devices, aerospace, and medical equipment.

The manufacturing process for HDI PCBs is more complex than traditional PCBs, and it typically involves the use of advanced techniques such as laser drilling and plating, as well as specialized materials and equipment. Overall, HDI PCB technology is well-suited for applications that require high density and complexity in a small package, and it is used in a wide range of industries, including consumer electronics, automotive, aerospace, and medical devices.

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