HDI (High Density Interconnect) PCBs are a type of printed circuit board that use advanced technology to create complex designs with smaller components and higher densities. HDI PCBs are characterized by the use of microvias, blind vias, and buried vias, which allow for more routing space and improved signal integrity. HDI PCBs are commonly used in high-performance products such as smartphones, tablets, and other handheld devices, as well as in computer and automotive applications. The use of HDI technology has enabled manufacturers to create smaller, lighter, and more complex products with higher performance and reliability.Here are processes of how is a pcb manufactured：

1.Designing the PCB: The first step in the PCB manufacturing process is to design the PCB using software such as Eagle or Altium. The design must include the layout of the circuit, the placement of components, and the routing of the interconnections.

2.Preparing the copper-clad board: The copper-clad board is prepared by cleaning it to remove any dirt, grease, or oxide. The board is then coated with a photosensitive layer called the resist.

3.Printing the circuit design onto the board: The circuit design is printed onto the board using a photomask. The photomask blocks light in areas where the resist should not be exposed, while allowing light to pass through in areas where the resist should be exposed.

4.Exposing the board to UV light: The board is exposed to UV light, which cures the resist in the exposed areas and makes it resistant to the etching solution.

5.Developing the board: The board is then developed to remove the uncured resist in the areas where the UV light was not exposed.

6.Etching the board: The board is etched using an etching solution that dissolves the copper in the areas where there is no resist. This creates the circuit pattern on the board.

7.Drilling the holes: Holes are drilled into the board to accommodate the components that will be placed on the board.

8.Plating the board: The board is plated with a layer of tin or gold to protect the copper from oxidation and to improve the solderability of the board.

9.Soldering the components: The components are soldered onto the board using a soldering iron or a reflow oven.

10.Testing the board: The board is tested to ensure that it functions correctly and meets the desired specifications.

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